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Ships within 48 hours · Estimated delivery Sep 6 - Sep 11
2 FCP SCP QC3
Suitable for most mobile phone screen separation
Line Lenght≈420mm
1x A14 stencil
JTX Swap Board CPU Chip Reballing Platform for iPhone 8-16 Pro Max Machine vision camera 2 FCP SCP QC3JTX SM 01 Swap Master 30 in 1 Tinning Platform with BGA stencil for iPhone 8 16 Pro Max motherboard replacement and CPU BGA chip reballing. Super Magnetic Positioning Tinning Platform for iPhone PCB board swapping chips rapid positioning, allows for reballing of multiple chip sizes at once, and the strong magnetism aids the reballing process, ensuring optimal solder component placement. Option: 1. SM 01: For iPhone 8 8P X Qualcomm. 2. SM 02: For
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