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Melting Temperature: 217°C
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MULTICOMP PRO - MC0603N101J500CT - SMD Multilayer Ceramic Capacitor
OM26630FDKM Dev KIT, NFC Frontend Development NXP Melting Temperature: 217°CNXP OM26630FDKM Development Kit, CLRC663 plus NFC Frontend, Access Management Applications, Easy to Use Kit Application Type: Access Management Silicon Manufacturer: NXP Silicon Core Number: CLRC663 plus Application Sub Type: NFC Frontend Development Kit Contents: Dev Kit CLRC663 Product Range: SVHC: No SVHC (15 Jan 2019)
